Temasek Engineering School has renewed its Memorandum of Understanding (MOU) with the Hong Kong Polytechnic University (HKPU), first signed on 9 Nov '99. The MOU, called the Remote Sharing of Operation and Training Environments (RESONATE), allows both parties to operate and use each other's equipment via high bandwidth networks on the Internet. The new MOU was signed by Engineering Director, Mrs Lay-Tan Siok Lie and HKPU's Associate Director of the Industrial Centre, Mr Paul Lau, at the Temasek Engineering School's conference room on 31 May '01.